Aluminum substrate features
1. Adopt surface mount technology (SMT);
2. To deal with thermal diffusion extremely effectively in the circuit design side;
3. Reduce product operating temperature, improve product power density and reliability, and extend product life;
4. Reduce product size, reduce hardware and assembly costs;
5. Replace brittle ceramic substrates for better mechanical durability.
PCB aluminum structure
PCB aluminum-based copper clad laminate is a kind of metal circuit board material, consists of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers:
Cireuitl.Layer circuit layer: equivalent to ordinary PCB copper clad laminates, the thickness of the line copper foil loz to 10oz.
Dielcctric Layer: The insulation layer is a layer of low thermal resistance thermal insulation material. Thickness: 0.003†to 0.006†inch is the core of aluminum-based copper clad laminates, and has obtained UL certification.
Base Layer: A metal substrate, typically aluminum or copper. Aluminum-based copper clad laminates and traditional epoxy glass cloth laminates.
The PCB aluminum substrate consists of a circuit layer, a thermally conductive insulating layer, and a metal base layer. The circuit layer (ie, copper foil) is usually etched to form a printed circuit to connect the components of the module to each other. Generally, the circuit layer requires a large current-carrying capacity, so a thicker copper foil should be used, and the thickness is generally 35 μm. 280μm; thermal insulation layer is the core technology of PCB aluminum substrate, it is generally made of special polymer filled with special polymer, small thermal resistance, excellent viscoelastic properties, ability to resist thermal aging, able to withstand mechanical and thermal stress . T-101, T-111, T-112, T-113, T-114 and T-200, T-300, T-400, T-500, T-600 and other high-performance PCB aluminum substrate thermal insulation layer is positive This technology is used to make it have excellent thermal conductivity and high-strength electrical insulation properties; the metal base layer is a support member of the aluminum substrate and requires high thermal conductivity, generally aluminum, copper can also be used (in which copper can Provides better thermal conductivity), suitable for conventional machining such as drilling, punching and cutting. Compared with other materials, PCB materials have advantages that cannot be compared. Suitable for SMT assembly of surface mount power components. No radiator is needed, the volume is greatly reduced, the heat dissipation effect is excellent, and the insulation and mechanical properties are good.
PCB aluminum substrate uses
1. Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.
2. Power supply: Switching regulator `DC/AC converter` SW regulator etc.
3. Communication electronic equipment: high-frequency amplifier `filtering appliances` transmission circuit.
4. Office Automation Equipment: Motor Drives, etc.
5. Cars: Electronic Regulators, Ignition, Power Controllers, etc.
6. Computer: CPU board `floppy drive` power supply device.
7. Power Module: Inverter `solid relay` rectifier bridge and so on.
8. Lamps and lanterns lighting: With the promotion of energy-saving lamps, aluminum substrates for LED lamps have also begun to be used on a large scale.
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