1. Cleaning: Ultrasonic cleaning of PCB or LED bracket and drying.
2. Mounting: After the silver electrode is placed on the bottom electrode of the LED die (large wafer), the expansion is performed, and the expanded die (large wafer) is placed on the thorn crystal table, and the die is pressed with a stylus under the microscope. One by one is mounted on the corresponding pad of the PCB or LED holder, and then sintered to cure the silver paste.
3. Pressure welding: The electrode is connected to the LED die by an aluminum wire or gold wire welding machine for the current injection lead. The LED is directly mounted on the PCB, and an aluminum wire welder is generally used.
4, packaging: through the dispensing, with epoxy to protect the LED die and wire. Dispensing on the PCB, there are strict requirements on the shape of the gel after curing, which is directly related to the brightness of the backlight product. This process will also take on the task of a point phosphor (white LED).
5. Soldering: If the backlight is made of SMD-LED or other packaged LEDs, the LEDs need to be soldered to the PCB before the assembly process.
6. Film cutting: Various diffusion films, reflective films, etc. required for backlighting by punching.
7. Assembly: According to the drawings, the various materials of the backlight are manually installed in the correct position.
8. Test: Check whether the photoelectric parameters of the backlight and the uniformity of light output are good.
9. Packaging: The finished product will be packed and put into storage as required.
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