Carbon - the basic element of all organic compounds - is expected to replace silicon as an alternative material for future semiconductors. According to the researchers, various structures based on elements directly above the silicon element of the periodic table exceed silicon in terms of thermal properties, frequency range, and even superconducting properties.
“In all carbon technologies, diamond is currently the most likely technology to be commercially available, as research on diamonds has been around for more than 15 years,†said Dean Freeman, senior analyst at Gartner. “And most other technologies. There is still a long way to go."
The heat dissipation performance of three-dimensional carbon-diamond is 10 times that of silicon, and is currently available from suppliers of 40nm to 15um diamond films on silicon wafers. The two-dimensional carbon-3 angstrom thick single-layer graphene has 10 times the electron mobility of silicon, so it can achieve the terahertz (THz) performance that silicon cannot achieve.
Similarly, one-dimensional carbon-1 nm diameter nanotubes can solve the speed bottleneck of digital silicon. Nanotubes will first appear as printable "inks" that are 10 times faster than competing organic transistors.
In addition, zero-dimensional carbon-60-atom hollow carbon sphere fullerenes can achieve high temperature superconducting properties that silicon cannot achieve. The superconducting temperature of the tightly packed fullerene with an alkali metal atom can reach 38K.
In a few years, carbon technology will be expected to replace almost every circuit material used today: conductors for interconnecting devices, semiconductors, isolators for device isolation, and more. But how quickly the industry can accept carbon-based materials remains to be seen, especially today when the economic outlook is still unclear.
Freeman introduced the experience of Nantero and SVTC Technolgies. The two companies are working together to provide the first-generation nanotube film development foundry for fabless silicon manufacturers who want to add carbon nanotube films as high-performance interconnect materials to commercial CMOS chips. "Nantero has developed several devices with carbon nanotubes, but the company has yet to find customers who are willing to commercialize these devices," he said.
"Carbon nanotubes are also expected to be interconnects for CMOS devices below 22nm, which means it will take at least five years to commercialize," Freeman noted.
Many mass production specialists, including DuPont, are developing carbon nanotube films, and industry giants such as NEC have successfully used carbon nanotube films on electronic castings on flexible plastic substrates.
Companies such as Nanocomp Technologies are trying to embed nanotubes in carbon sheets to detect breaks or other structural defects, while developing nanotube cables that are as conductive as copper and 80% lighter than copper. .
“There are already many applications in the development of flexible electronic materials, including military and civilian markets,†said Phaedon Avouris, IBM's management of carbon transistor projects. They originally studied nanotubes and recently moved to graphene. "Of course, there are already many nanotube applications, and the materials used to make them have better electrical and thermal conductivity, but the fabrication of thin-film transistors with micron-sized channels on flexible substrates will be the first commercial application of nanotubes."
Perhaps within a decade, carbon electronics developers will not compete directly with the mature technology of silicon semiconductor vendors. Instead, they wanted to create a whole new set of electronic materials, starting with micron-sized devices that recall the early larger silicon transistors. Vendors such as Applied Nanotech are developing printable nanotube inks that can be used in low-cost cryogenic deposition systems using non-contact aerosol inkjet printers, such as those offered by Optomec. These systems are primarily used for cost sensitive applications such as plastic solar cells and RFID tags on flexible polymer substrates.
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